关于芯片封装

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精华序号：24
来自论坛：小熊在线 《板卡论坛》
内容说明：各种芯片长相都不一样，它们都有什么优点或缺点呢？

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• 没有人说话~~~~~~我来：(1873字) 电火花 (44000)于2001/01/26(20:51:32)..

一、DIP封装
70年代流行的是双列直插封装，简称DIP(Dual In-line Package)。DIP封装结构具有以下特点:
1.适合PCB的穿孔安装; 2.比TO型封装易于对PCB布线; 3.操作方便
DIP封装结构形式有:多层陶瓷双列直插式DIP，单层陶瓷双列直插式DIP，引线框架式DIP(含玻璃陶瓷封接式，塑料包封结构式，陶瓷低熔玻璃封装式)。
衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比，这个比值越接近1越好。以采用40根I/O引脚塑料包封双列直插式封装(PDIP)的CPU为例，其芯片面积/封装面积=3×3/15.24×50=1：86,离1相差很远。不难看出，这种封装尺寸远比芯片大，说明封装效率很低，占去了很多有效安装面积
Intel公司这期间的CPU如8086、80286都采用PDIP封装。
二、芯片载体封装 　　
80年代出现了芯片载体封装，其中有陶瓷无引线芯片载体LCCC(Leadless Ceramic Chip Carrier)、塑料有引线芯片载体PLCC(Plastic Leaded Chip Carrier)、小尺寸封装SOP(Small Outline Package)、塑料四边引出扁平封装PQFP(Plastic Quad Flat Package)，封装结构形式如图3、图4和图5所示。
以0.5mm焊区中心距，208根I/O引脚的QFP封装的CPU为例，外形尺寸28×28mm，芯片尺寸10×10mm，则芯片面积/封装面积=10×10/28×28=1：7.8，由此可见QFP比DIP的封装尺寸大大减小。QFP的特点是:
1.适合用SMT表面安装技术在PCB上安装布线; 2.封装外形尺寸小，寄生参数减小，适合高频应用; 3.操作方便; 4.可靠性高。
在这期间，Intel公司的CPU，如Intel 80386就采用塑料四边引出扁平封装PQFP。
三、BGA封装
90年代随着集成技术的进步、设备的改进和深亚微米技术的使用，LSI、VLSI、ULSI相继出现，硅单芯片集成度不断提高，对集成电路封装要求更加严格，I/O引脚数急剧增加，功耗也随之增大。为满足发展的需要，在原有封装品种基础上，又增添了新的品种——球栅阵列封装，简称BGA(Ball Grid Array Package)。
BGA一出现便成为CPU、南北桥等VLSI芯片的高密度、高性能、多功能及高I/O引脚封装的最佳选择。其特点有:
1.I/O引脚数虽然增多，但引脚间距远大于QFP，从而提高了组装成品率;2.虽然它的功耗增加，但BGA能用可控塌陷芯片法焊接，简称C4焊接，
从而可以改善它的电热性能:3.厚度比QFP减少1/2以上，重量减轻3/4以上;4.寄生参数减小，信号传输延迟小，使用频率大大提高;5.组装可用共面焊接，可靠性高;6.BGA封装仍与QFP、PGA一样，占用基板面积过大;
Intel公司对这种集成度很高(单芯片里达300万只以上晶体管)，功耗很大的CPU芯片，如Pentium、Pentium Pro、PentiumⅡ采用陶瓷针栅阵列封装CPGA和陶瓷球栅阵列封装CBGA，并在外壳上安装微型排风扇散热，从而达到电路的稳定可靠工作。
四、面向未来新的封装技术
BGA封装比QFP先进，更比PGA好，但它的芯片面积/封装面积的比值仍很低。
Tessera公司在BGA基础上做了改进，研制出另一种称为μBGA的封装技术，按0.5mm焊区中心距，芯片面积/封装面积的比为1:4，比BGA前进了一大步。 　　
1994年9月日本三菱电气研究出一种芯片面积/封装面积=1:1.1的封装结构，其封装外形尺寸只比裸芯片大一点点。也就是说，单个IC芯片有多大，封装尺寸就有多大，从而诞生了一种新的封装形式，命名为芯片尺寸封装，简称CSP(Chip Size Package或Chip Scale Package)。CSP封装具有以下特点:
1.满足了LSI芯片引出脚不断增加的需要;2.解决了IC裸芯片不能进行交流参数测试和老化筛选的问题;3.封装面积缩小到BGA的1/4至1/10，延迟时间缩小到极短。
曾有人想，当单芯片一时还达不到多种芯片的集成度时，能否将高集成度、高性能、高可靠的CSP芯片(用LSI或IC)和专用集成电路芯片(ASIC)在高密度多层互联基板上用表面安装技术(SMT)组装成为多种多样电子组件、子系统或系统。由这种想法产生出多芯片组件MCM(Multi Chip Model)。它将对现代化的计算机、自动化、通讯业等领域产生重大影响。MCM的特点有:
1.封装延迟时间缩小，易于实现组件高速化;2.缩小整机/组件封装尺寸和重量，一般体积减小1/4，重量减轻1/3;3.可靠性大大提高。
随着LSI设计技术和工艺的进步及深亚微米技术和微细化缩小芯片尺寸等技术的使用，人们产生了将多个LSI芯片组装在一个精密多层布线的外壳内形成MCM产品的想法。进一步又产生另一种想法:把多种芯片的电路集成在一个大圆片上，从而又导致了封装由单个小芯片级转向硅圆片级(wafer level)封装的变革，由此引出系统级芯片SOC(System On Chip)和电脑级芯片PCOC(PC On Chip)。
随着CPU和其他ULSI电路的进步，集成电路的封装形式也将有相应的发展，而封装形式的进步又将反过来促成芯片技术向前发展。 (硬件传真)

• 别逼我贴!!(10字) 懒猫.com (44006)于2001/01/26(21:01:02)..

我可会贴原文的!

• E文？(空) AWard (44007)于2001/01/26(21:01:47)..

• 正是!C-MEDIA最新CMI8738-6CH芯片的介绍!(1392字) 懒猫.com (44075)于2001/01/26(21:54:01)..

CMI-8738/PCI C3DX series
PCI-Base HRTF 3D Extension Positional Audio Chip
CMI-8738/PCI C3DX 系列
PCI HRTF 3D音效扩展芯片
With high speed PCI V2.1 bus controller and legacy audio SBPro? DSPemulator,CMI8738 is designed for PC add-in cards and all-in-one motherboards. No external CODEC is needed in CMI8738: CMI-8738 supports the legacy audio – SBPRO?, FM emulator/DLS wavetable music synthesis, and HRTF 3D positional audio functions. Drivers support EAX?, Karaoke Key, Echo……functions. Above all CMI8738 supports PCtel? HSP56 (1789) interface.
CMI8738是为PC插卡和一体化主板设计的声音芯片,带有高速PCI2.1总线控制器和SBPro DSP模拟,无需外加AC'97 Codec芯片,支援传统音效应用-SBPRO?,FM合成器仿真,DLS波表合成,以及HRTF 3D定位音效函数,驱动程序支持EAX?, Karaoke Key, 回声等功能,此外还带有 PCtel? HSP56 (1789) 软猫接口
图片: www.cmedia.com.tw/images/8738a.jpg
Being compatible with A3D? and DirectSound? 3D, CMI8738 meets PC99? requirements, and supports professional digital audio interface such as 24-bit SPDIF IN (0.5V ~ 5V)and OUT(44.1K and 48K format).
CMI8738 uses HRTF 3D extension technology to enhance traditional HRTF 3D positional audio by substituting two-speaker system by four or six - speaker one (it supports additional 2 ch 16-bit DAC to provide rear side audio and another 2 ch for subwoofer/Center). It greatly improves HRTF 3D positional audio quality and successfully removes the sweet spot limitations: users can enjoy genuine 3D audio gaming effects, and don't have to worry about the environmental confinement any more.
CMI8738符合PC99规范,与A3D? and DirectSound?兼容,并且支持24位SPDIF输入(0.5V-5V电平)以及输出(44K/48K采样率)
CMI8738使用了HRTF 3D音效扩展技术,并把传统的2声道HRTF增强为4/6声道系统(通过添加2个DAC
实现),极大的提高了3D音效的品质,现在使用者可以欣赏原汁原味的3D音效而不必再受听音环境的限制.
Features:
6CH DAC for AC3? 5.1CH purpose.
HRTF-based 3D positional audio, supporting DirectSound? 3D and A3D? interface
Supports 4.1/5.1 speakers, C3DX positional audio in 4 / 6 CH speaker mode
Legacy audio SBPRO? compatible
DLS-based wavetable music synthesizer, supports DirectMusic?
Professional digital audio interface supporting 24-bit SPDIF IN and OUT (44.1K and 48K format)
Built-in 32ohm Earphone buffer
Built-in PCtel? HSP56 Modem? interface
Drivers support EAX?, Karaoke Key, Echo…
● MPU-401 port/ Dual game port
● 16-bit full duplex CODEC
● Built-in ZV port
● 32-bit PCI bus master
● External E2PROM interface
***● Single chip design, digital power +3.3V, analog power +5V, 128 pins QFP
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特点:
6声道 DAC适 合于AC3? 5.1CH应用.
基于HRTF的3D定位音频,支持DirectSound3D/A3D接口.
...后面懒的翻了,...
结构示意图:http://www.cmedia.com.tw/images/8738_Series.gif
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请注意:8738/6CH的不同版本
CMI8738/PCI-6CH C3DX Series Chip Function List
Model |MODEM |SPDIF/ZVport
CMI8738/PCI-6CH |YES |YES
CMI8738/PCI-6CH-MX |NO |YES
CMI8738/PCI-6CH-LX |NO |NO
***************
不要上当哦!

• 不错不错,大张见识!!(空) 极光 (44081)于2001/01/26(21:58:05)..

• 还是双语对照嘛！(空) AWard (44078)于2001/01/26(21:55:41)..

• 用10分钟自己翻的,下面请大家来试试自己的水平吧!(1662字) 懒猫.com (44098)于2001/01/26(22:21:26)..

PCI Audio
Canyon3D™-2
The flagship of ESS Technology抯 audio product line, the Canyon3D™-2, is a multichannel, single-chip audio accelerator. The Canyon3D™-2 is capable of four-channel analog output, and offers advanced features and configuration options, including bass and treble adjustment capabilities, hardware equalizer, and environmental controls, as well as digital support for Dolby® and THX® surround-sound formats. The Canyon3D™-2 also offers multispeaker positioning and 3D placement to deliver the ultimate in sound functionality. With Sony®/Philips® Digital Interface (S/PDIF) input and output, the Canyon3D™-2抯 feature set includes: Sensaura™ True HRTF 3D positional MultiDrive™ technology, for rich multispeaker and 3D sound effects and audio placement, and Sensaura ZoomFX™, MacroFX™, and EnvironmentalFX™, for the precise magnification and placement of background audio. Optimized for DirectX® 8 and use with DirectSound3D® hardware acceleration, the new audio solution carries a six-channel option for the addition of more speakers, as well as compatibility with I3DL2, A3D 1.0, EAX 1.0, EAX 2.0, and DirectSound® compatibility for use with legacy video games and other software applications. Click on the links below for more information on the PCI audio accelerator.
Canyon3D™-2 ES1992
Allegro™
The Allegro™ family of products from ESS Technology includes single-chip PCI audio-modem accelerators that combine advanced audio and modem functionality in a highly integrated PCI solution for the multimedia PC. The Allegro™ integrates a high-fidelity AC?7 codec, to offer a single-chip standalone audio solution. With the addition of a MC?7 modem codec, the Allegro™ can operate as both an audio accelerator and a V.90 HSP modem. The external AC-Link allows the Allegro™ to use an AC?7 codec for docking or four-speaker applications. The Allegro™ PCI audio accelerator products are available for desktop applications and for mobile applications with the added I2S interface. Click on the links below for more information ESS抯 Allegro™ products.
Audio Accelerator ES1989 for desktop
Audio Accelerator ES1988 for mobile
Maestro-3™
The Maestro-3™ from ESS Technology is a PCI audio-modem digital accelerator that combines advanced audio and modem functionality in a highly flexible PCI solution for the multimedia PC. When used with an AC?7 codec, the Maestro-3™ offers a high-fidelity accelerated audio solution. Adding a MC?7 modem codec also allows the Maestro-3™ to operate as both an audio accelerator and a V.90 HSP modem. An additional AC?7 codec can also be used for docking applications. Click on the link below for more information on the Maestro-3™ PCI digital audio accelerator solution.
Digital Audio Accelerator ES1980
PCI AudioDrive™
揝imple and effective?is the best description for the ESS Technology PCI AudioDrive™ products. Based on the proven architecture of ESS Technology ISA AudioDrive™ products, the PCI AudioDrive™ is a quick and easy way to develop a complete audio solution for any platform that requires a PCI interface. The high-bandwidth PCI bus and efficient SoundBlaster-compatible architecture make the PCI AudioDrive™ the natural solution for all emerging non-Windows markets. Already in wide use in the PC environment, the AudioDrive™ products can also be found on many Internet appliances and set-top box solutions. The AudioDrive™ products are available for desktop applications and for mobile applications with the added I2S interface. Click on the links below for more information on the PCI AudioDrive™ products.

• 对于像我这样E文差的人来说真是太好了~~~~~~~(空) 电火花 (44085)于2001/01/26(22:01:12)..

• http://developer.intel.com/design/litcentr/index.htm(12字) AWard (44086)于2001/01/26(22:04:29)..

大量资料下载！太实惠了！

• ◎ 从写作风格来看，我觉得这篇东西应该是国人原创(空) eio (44071)于2001/01/26(21:49:03)..

• 哦？？是吗？这个我不知道~我从其他地方COPY来的！胡哈哈哈哈哈~~~~~~~~~~~(空) 电火花 (44074)于2001/01/26(21:53:40)..

• 我很早以前在《微型计算机》上看到过(空) AWard (44076)于2001/01/26(21:54:37)..

• 应该是的~~~~~~~~~~~~~不过！我要用深水炸弹了！！(空) 电火花 (44044)于2001/01/26(21:34:28)..

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